Few months ago there were rumors that Samsung might launch their new flagship in metal to collide head on with HTC’s premium offering but it turned out to just a rumor when the company’s CEO rubbished the idea. But the rumor seems to get quite stronger as days pass by, as unnamed industry sources cite that Samsung is indeed prepping a metal-clad smartphone in the Q2 of this year, preferably in June, to take on the LG G3.
Named as Samsung Galaxy S5 Prime, the specifications are nothing short of impressive with 5.2″ QHD screen( 2560 x 1440 pixels, 564ppi) leading the way. The phone is supposed to come with two variants as ususal with Samsung these days. An Octa-core Exynos 5430 chipset with quad 2.1GHz Cortex-A15 and quad 1.5GHz Cortex-A7 cores in addition to an 600MHz ARM Mali GPU seems headed towards the home country and Asia. The United States will be treated to Qualcomm’s yet to be announced quad-core Snapdragon 805 chipset @ 2.7ghz and Adreno 420 GPU at 500MHz.
According to AsiaPaper , this is based on the secret project from the Samsung’s R&D division codenamed ‘Project KQ’ which earlier showed samples of a Aluminium clad smartphone which borrowed its exterior looks from the S5. The main competitor for the S5 Prime is the LG G3 which is supposed to release by the same time frame which features 5.5″ QHD screen with a slightly less 534ppi and a Snapdragon 801 SOC.